IMEN

Deputy Director
Principal Research Fellow

Associate Prof. Dr. Azman Jalar
Phone: +603 89118552 or +603-89216996 
E-mail:  This email address is being protected from spambots. You need JavaScript enabled to view it.

ACADEMIC QUALIFICATION:

Doctor of Philosophy, 2001, Metallurgy and Materials, University of Birmingham, UK.
BSc. (Hons), 1995, Materials Science, UKM

Professional Affiliation:

Member                             Institute of Electrical and Electronics Engineers (IEEE), USA
Member                             Malaysian Solid State Science and Technology (MASS)
Member                             Electron Microscopy Society of Malaysia
Member                             Akademi Sains Islam Malaysia (ASASI)

RESEARCH ACTIVITIES:

Supervised 42 undergraduate students, 12 Master students and 3 PhD students
Involved 7 research projects
Published 16 journal (12 international and 4 local) and 54 proceedings

SELESTED PUBLICATIONS:

1. Karen Wong Mee Chu, Abdul Razak Daud and Azman Jalar, 2008 , Pengaruh Unsur Zikronium Terhadap Sifat Mekanik Aloi Tempaan Al-1.2Si-0.5Mg-0.25Fe, Sains Malaysiana, vol  37, No 2, pp 189-193

2. Koh Aik Khoon, Azman Jalar@Jalil, Abdul Razak Daud, Roslan Abd-Shukor, Supian Samat, Ibrahim Abu Talib, Mazlan Othman and BaharuddinYatim. 2008. Changes are Afoot in Physics Introductory Texts of Today, College Student Journal, Vol 42, pp 542-544

3. S. Abdullah, Z. Endut, I. Ahmad, A. Jalar and S. M. Yusof, 2008, Dicing Laminated Wafer for QFN Stacked Die Packaging. Advanced Materials Research, Vol 31 (2008), pp 202-205

4. Koh Aik Khoon and Azman Jalar. 2008. Some Thought on the Issue of Making the Liberal Science Courses More Appealing to Academics, College Student Journal, Vol 42, pp 99 - 102

5. M.K. Md Arshad, A. Jalar, I. Ahmad and G. Omar, 2007, The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition, American Journal of Applied Sciences 4(3), pp 133-141

6. M.K. Md Arshad, A. Jalar, I. Ahmad, 2007, Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process, Microelectronic Reliability, Vol. 47, pp 1120-1126

7. M.K. Md Arshad, A. Jalar, I. Ahmad , G. Omar and U. Hashim, 2006, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition, Journal of Electronic Packaging Transactions of the ASME , September 2006,  Vol 128, Issue 3, pp. 246-250

8. Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar and Ghazali Omar, 2006, Effect of Laminated Wafer Toward Dicing Process and Alternative Double Pass Sawing Method to Reduce Chipping, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No 1, January 2006, pp 17-24

9. Mohd Khairudin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar, 2006, The Surface Characteristics of Under Bump Metallurgy (UBM)in electroless Nickel Immersion Gold (ENIG) Deposition, Microelectronic Reliability, Vol. 46, pp 367-379

10. Shahrul Nizam Shahdan, Azman Jalar and Muhammad Azmi Abdul Hamid, 2006, Microstructure of Solder Joint in Used Mobile Phone, Materials Science Forum, Materials Science Forum Vol. 517, pp. 123-128