IMEN

Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN) telah ditubuhkan secara rasminya pada bulan November 2002. IMEN merupakan satu inisiatif yang strategik untuk menjalankan aktiviti penyelidikan pelbagai disiplin dalam bidang Kejuruteraan Mikro dan Nanoelektronik dan menyediakan pusat R & D kebangsaan Malaysia dalam bidang ini. Penyelidikan IMEN bertujuan untuk membangunkan teknologi dan si...

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Microelectronics Packaging

The continuous pressure to reduce size, weight and cost, while increasing the functionality of portable products, has created a tremendous demand for innovative , cost-effective, IC packaging solutions.

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Nanoelectronics Systems

Most of the system design at IMEN involves VLSI with CMOS technology. We are now preparing ourselves to get into the submicron and nanometer system design technology where more components will be packed into a more and more tiny space of area. IMEN focus the research in this field on circuits to assist MEMS devices. The strength of the group is academicians in and outside of the faculty and a team...

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Photonics

Photonics is the technology of generating and harnessing light and other forms of radiant energy whose quantum until is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated syste...

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MEMS-Nanoelectronics

MEMS is a system that integrates mechanical,sensor and electronic elements on one silicon chip through microfabrication technologies. The field of MEMS encompasses devices created with micromachining technologies originally developed to produce integrated circuits, as well as non-silicon based devices created by the same micromachining or other techniques.

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IMEN Update

Deputy director

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joomla

azman

Deputy Director
Principal Research Fellow

Associate Prof. Dr. Azman Jalar
Phone: +603 89118552 or +603-89216996
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ACADEMIC QUALIFICATION:

Doctor of Philosophy, 2001, Metallurgy and Materials, University of Birmingham, UK.
BSc. (Hons), 1995, Materials Science, UKM

Professional Affiliation:

Member                             Institute of Electrical and Electronics Engineers (IEEE), USA
Member                             Malaysian Solid State Science and Technology (MASS)
Member                            Electron Microscopy Society of Malaysia
Member                             Akademi Sains Islam Malaysia (ASASI)

RESEARCH ACTIVITIES:

Supervised 42 undergraduate students, 12 Master students and 3 PhD students
Involved 7 research projects
Published 16 journal (12 international and 4 local) and 54 proceedings

SELESTED PUBLICATIONS:

Karen Wong Mee Chu, Abdul Razak Daud and Azman Jalar, 2008 , Pengaruh Unsur Zikronium Terhadap Sifat Mekanik Aloi Tempaan Al-1.2Si-0.5Mg-0.25Fe, Sains Malaysiana, vol 37, No 2, pp 189-193
Koh Aik Khoon, Azman Jalar@Jalil, Abdul Razak Daud, Roslan Abd-Shukor, Supian Samat, Ibrahim Abu Talib, Mazlan Othman and BaharuddinYatim. 2008. Changes are Afoot in Physics Introductory Texts of Today, College Student Journal, Vol 42, pp 542-544
S. Abdullah, Z. Endut, I. Ahmad, A. Jalar and S. M. Yusof, 2008, Dicing Laminated Wafer for QFN Stacked Die Packaging. Advanced Materials Research, Vol 31 (2008), pp 202-205
Koh Aik Khoon and Azman Jalar. 2008. Some Thought on the Issue of Making the Liberal Science Courses More Appealing to Academics, College Student Journal, Vol 42, pp 99 - 102
M.K. Md Arshad, A. Jalar, I. Ahmad and G. Omar, 2007, The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition, American Journal of Applied Sciences 4(3), pp 133-141
M.K. Md Arshad, A. Jalar, I. Ahmad, 2007, Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process, Microelectronic Reliability, Vol. 47, pp 1120-1126
M.K. Md Arshad, A. Jalar, I. Ahmad , G. Omar and U. Hashim, 2006, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition, Journal of Electronic Packaging Transactions of the ASME , September 2006, Vol 128, Issue 3, pp. 246-250
Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar and Ghazali Omar, 2006, Effect of Laminated Wafer Toward Dicing Process and Alternative Double Pass Sawing Method to Reduce Chipping, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No 1, January 2006, pp 17-24
Mohd Khairudin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar, 2006, The Surface Characteristics of Under Bump Metallurgy (UBM)in electroless Nickel Immersion Gold (ENIG) Deposition, Microelectronic Reliability, Vol. 46, pp 367-379
Shahrul Nizam Shahdan, Azman Jalar and Muhammad Azmi Abdul Hamid, 2006, Microstructure of Solder Joint in Used Mobile Phone, Materials Science Forum, Materials Science Forum Vol. 517, pp. 123-128