Sains Malaysiana 47(5)(2018): 1005–1010

http://dx.doi.org/10.17576/jsm-2018-4705-16

 

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

(Effect of Coloured Pigment on Intermetallic Compound Growth of Sn-3.0Ag-0.5Cu Solder Joint)

 

AZMAN JALAR^1,2, MARIA ABU BAKAR^1*, ROSLINA ISMAIL¹, NAJIB SAEDI IBRAHIM³ & MOHD ARIFFIN AMBAK³

 

¹Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

²School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

³Redring Solder (M) Sdn. Bhd., Lot 17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia

 

Received: 21 September 2017/Accepted: 30 December 2017

 

 

ABSTRAK

Pewarnaan pes pateri membuka suatu ruang kepada keperluan dalam teknologi untuk proses pengenalpastian, penandaan, piawaian, pengujian dan penilaian terhadap antarasambungan pes pateri. Dua jenis pigmen pewarna iaitu hijau (G) dan bercahaya dalam gelap (GD) digunakan untuk mengkaji kesan pewarnaan sambungan pateri ke atas kestabilan antarasambungan pateri Sn-3.0Ag-0.5Cu (SAC 305). Pes pateri tanpa warna digunakan sebagai sampel kawalan untuk membandingkan keputusan kajian. Uji kaji penuaan sesuhu digunakan untuk melihat perubahan pertumbuhan sebatian antara logam (IMC). Pigmen pewarna GD dengan peratusan sebanyak 5% telah menunjukkan kestabilan pertumbuhan IMC dengan perubahan pertumbuhan yang paling rendah iaitu sebanyak 5.6 μm bagi sambungan pateri yang berwarna berbanding dengan peratusan pigmen pewarna yang lebih tinggi dengan perubahan pertumbuhan IMC sehingga 9 μm selepas didedahkan kepada penuaan sesuhu pada 150°C selama 1000 jam. Walau bagaimanapun, kestabilan pertumbuhan IMC dengan penggunaan pes pateri berwarna adalah lebih rendah berbanding dengan pes pateri tidak berwarna. Maka penambahan pigmen pewarna hendaklah dipertimbangkan dengan mengambil kira kestabilan mikrostruktur dan pertumbuhan lapisan IMC supaya tidak menjejaskan kualiti dan kebolehharapan sesuatu sambungan pateri.

 

Kata kunci: Bahan pateri Sn-Ag-Cu; pateri berwarna; pertumbuhan sebatian antara logam; pigmen pewarna; sambungan pateri

 

ABSTRACT

The colouration of solder paste opens up a space for technology requirements for the identification, marking, standardization, testing and evaluation processes of the solder inconnection. Two types of colour pigments, green (G) and glow in the dark (GD) are used to study the effect of coloured solder on stability of solder joint Sn-3.0Ag-0.5Cu (SAC 305). Colourless solder paste is used as a control sample to compare the results of the study. The isothermal aging test is used to observe the growth of intermetallic compound (IMC). GD colour pigment with a percentage of 5% has shown growth stability with the lowest changes of IMC growth, 5.6 μm for coloured solder joint as compared to other higher colour pigment percentage with higher changes of IMC growth up to 9 μm after subjected to isothermal aging at 150°C for 1000 h. However, IMC growth stability with the use of coloured solder paste is lesser than the colourless solder paste. Therefore, the addition of colour pigments should be considered on the stability of the microstructure and the growth of the IMC layer so that it will not affect the solder joint quality and reliability.

 

Keywords: Colour pigment; coloured solder; intermetallic compound growth; solder joint; solder material Sn-Ag-Cu

REFERENCES

Bakar, M.A., Jalar, A., Daud, A.R., Ismail, R., Lah, N.C.A. & Ibrahim, N.S. 2016. Nanoindentation approach on investigating micromechanical properties of joining from green solder materials. Sains Malaysiana45(8): 1275-1279.

Bang, J., Yu, D.Y., Ko, Y.H., Kim, M.S., Nishikawa, H. & Lee, C.W. 2017. Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint. Journal of Alloys and Compounds 725: 992-1001.

Boschetti, C., Henderson, J., Evans, J. & Leonelli, C. 2016. Mosaic tesserae from Italy and the production of Mediterranean coloured glass (4rd century BCE-4th century CE). Part I: Chemical composition and technology. Journal of Archaeological Science: Reports 7: 303-311.

Burke, J.E. & Turnbull, D. 1952. Recrystallization and grain growth. Progress in Metal Physics 3: 220-292.

Choudhury, S.F. & Ladani, L. 2016. Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis. Journal of Alloys and Compounds 680: 665-676.

Frear, D.R. & Tu, K.N. 2001. Metallurgical factors. Dlm. Area Array Interconnection Handbook, disunting oleh Puttlitz, K.J. & Totta, P.A. New York: Springer & Business Media. pp. 1108-1143.

Holgado, P.H., Holgado, M.J., Román, M.S.S. & Rives, V. 2015. Ni–Fe mixed oxides prepared by calcination of layered double hydroxides: Potential ts for the ceramic industry. Ceramics International 41(7): 8451-8460.

Hu, X., Xu, T., Jiang, X., Li, Y., Liu, Y. & Min, Z. 2016. Effect of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate. Appl. Phys. A 122: 278.

Humphreys, F.J. & Hatherly, M. 2004. Recrystallization and Related Annealing Phenomena. Amsterdam: Elsevier.

Ismail, N., Ismail, R., Abd Aziz, N.I. & Jalar, A. 2016. Wettability of CNT-doped solder under isothermal aging. Materials Science Forum 857: 76-78.

Jiang, B.C., Wang, C.C. & Hsu, Y.N. 2007. Machine vision and background remover-based approach for PCB solder joints inspection. International Journal of Production Research 45(2): 451-464.

Jovaní, M., Sanz, A., Beltrán-Mir, H. & Cordoncillo, E. 2016. New red-shade environmental-friendly multifunctional t based on Tb and Fe doped Y₂Zr₂O₇ for ceramic applications and cool roof coatings. Dyes and Pigments 133: 33-40.

Kim, H.K. & Kim, S.H. 2016. Optical properties of pre-colored dental monolithic zirconia ceramics. Journal of Dentistry 55: 75-81.

Kim, J.H. 2000. Method and Apparatus for Inspecting Solder Joints. Patent Number: 6,111,602.

Kim, J.H. & Cho, H.S. 1995. Neural network-based inspection of solder joints using a circular illumination. Image and Vision Computing 13(6): 479-490.

King, C.E. & Gulino, A.J. 1998. Preformed Solder Parts Coated with Parylene in a Thickness Effective to Exhibit Predetermined Interference Colors. Patent Number: 5,789,068.

Li, Z.L., Li, G.Y., Li, B., Cheng, L.X., Huang, J.H. & Tang, Y. 2016. Size effect on IMC growth in micro-scale Sn-3.0Ag- 0.5Cu-0.1TiO₂ solder joints in reflow process. Journal of Alloys and Compounds 685: 983-991.

Lin, Y.C., Shih, T.Y., Tien, S.K. & Duh, J.G. 2007. Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints. Scripta Materialia56: 49-52.

Mantovani, L., Tribaudino, M., Dondi, M. & Zanelli, C. 2015. Synthesis and color performance of CaCoSi₂O₆ pyroxene, a new ceramic colorant. Dyes and Pigments 120: 118-125.

Mayappan, R., Hassan, A.A., Ghani, N.A.A., Yahya, I. & Andas, J. 2016. Improvement in intermetallic thickness and joint strength in carbon nanotube composite Sn-3.5Ag lead-free solder. Materials Today: Proceedings 3: 1338-1344.

Möncke, D., Papageorgiou, M., Winterstein-Beckmann, A. & Zacharias, N. 2014. Roman glasses coloured by dissolved transition metal ions: Redox-reactions, optical spectroscopy and ligand field theory. Journal of Archaeological Science 46: 23-36.

Nor, N.A.M., Aziz, N., Adnan, A.F.M., Taha, R.M. & Arof, A.K. 2016. Chromaticity and color saturation of ultraviolet irradiated poly (vinyl alcohol)-anthocyanin coatings. Optical Materials 56: 18-21.

Ren, G., Wilding, I.J. & Collins, M.N. 2016. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections. Journal of Alloys and Compounds 665: 251-260.

Skowroński, Ł., Trzcinski, M., Antończak, A.J., Domanowski, P., Kustra, M., Wachowiak, W., Naparty, M.K., Hiller, T., Bukaluk, A. & Wronkowska, A.A. 2014. Characterisation of coloured TiOx/Ti/glass systems. Applied Surface Science 322: 209-214.

Thieme, C., Waurischk, T., Lin, C. & Rüssel, C. 2016. Lilac ceramic ts based on Ba0.5Sr0.5Zn2−xNixSi₂O₇ solid solutions. Ceramics International 42(11): 13035-13040.

Yahaya, M.Z., Ani, F.C., Samsudin, Z., Abdullah, M.Z. & Mohamad, A.A. 2016. Hardness profiles on Sn-3.0Ag- 0.5Cu-TiO₂ composited solder by nanoindentation. Materials Science and Engineering A669: 178-186.

Zeng, Z., Ma, L. & Suwa, M. 2011. Algorithm of locating PCB components based on colour distribution of solder joints. Int. J. Adv. Manuf. Technol. 53: 601-614.

Zhang, L., Liu, Z.Q., Yang, F. & Zhong, S.J. 2017. Cu₆Sn₅ whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer. Materials 10(4): 327.

 

 

*Corresponding author; email: maria@.ukm.edu.my