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http://dx.doi.org/10.17576/jsm-2018-4708-27
Kelakuan
Migrasi Elektrokimia Pateri SAC305 dalam Larutan Natrium
Hidroksida pada Kepekatan yang Pelbagai
(Electrochemical
Migration Behaviour of SAC305 Solder in Various Concentrations of Sodium Hydroxide Solution)
EMEE MARINA SALLEH1, NORINSAN KAMIL OTHMAN1* & AZMAN JALAR2
1School
of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan
Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia
2Institute
of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, 43600
UKM Bangi, Selangor Darul Ehsan, Malaysia
Received:
5 October 2017/Accepted: 27 April 2018
ABSTRAK
Pengecilan saiz antarahubung dalam papan litar bercetak (PCB)
membawa kepada migrasi elektrokimia (ECM) dan kemudiannya
menyebabkan litar pintas. ECM merupakan salah satu jenis kakisan
yang ketara menjejaskan kebolehtahanan kakisan kepada peralatan elektronik.
Migrasi ini ialah fenomena ion logam bergerak dari satu kawasan ke kawasan yang
lain di dalam medium logam, menyebabkan endapan berlaku di bahagian katod logam
ataupun aloi. Justeru, kajian ini dijalankan untuk menentukan kelakuan kakisan
melalui ujian titisan air (WDT) pateri bebas plumbum Sn-3.0Ag-0.5Cu
(SAC305)
di dalam larutan natrium hidroksida (NaOH) yang berbeza kepekatan iaitu 0.05M,
0.1M, 0.5M dan 1.0M. Purata masa-ke-kegagalan (MTTF)
pateri SAC305 berkurangan apabila
didedahkan kepada medium larutan NaOH yang semakin tinggi kepekatannya.
Pembentukan dendrit dikesan selepas kakisan pateri SAC305 akibat proses ECM dan menyebabkan litar pintas. Hasil kakisan Cu(OH)2 dan
SnO2 juga didapati terbentuk
selepas pateri terkakis. Bopeng kecil kelihatan terbentuk terutamanya pada
kepekatan yang tinggi adalah disebabkan oleh perlarutan pada anod Sn.
Kata kunci: Bahan pateri Sn-Ag-Cu; kakisan; migrasi elektrokimia;
pateri tanpa plumbum; ujian titisan air
ABSTRACT
Miniaturization of the interconnection size in printed circuit
board (PCB) leads to electrochemical migration (ECM)
causing short circuit. ECM is a form of corrosion which
significantly affects the corrosion reliability for most of the electronic
equipment. Migration is a phenomenon in which the metallic ions are moving from
one region to another region of metal, resulting in metal or alloy deposits at
cathodic part. Hence, this study was performed in order to determine corrosion
behaviour of SAC305 solder via water drop test (WDT)
in various concentration of sodium hydroxide (NaOH) included 0.05M, 0.1M, 0.5M
and 1.0M. The results showed that mean time to failure (MTTF)
of SAC305 solder reduced when the samples were exposed to
higher concentration of NaOH solution. Formation of dendrite was observed after SAC305 solder corroded due to ECM process which resulted in short
circuit. Corrosion product such as Cu(OH)2 and
SnO2 were formed after the solder
was corroded. Tiny pitting was formed especially at high concentration of NaOH
which was due to dissolution of Sn anode.
Keywords: Corrosion; electrochemical migration;
lead free solder; Sn-Ag-Cu solder material; water drop test
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