Sains Malaysiana 48(6)(2019): 1267–1272

http://dx.doi.org/10.17576/jsm-2019-4806-14

Kesan Penuaan Sesuhu terhadap Sifat Mikro Kekerasan Pempaterian Sn-Ag-Cu/CNT/Cu Menggunakan Pelekukan Nano

(Effect of Isothermal Aging on Microhardness Properties of Sn-Ag-Cu/CNT/Cu using Nanoindentation)

NORLIZA ISMAIL¹, AZMAN JALAR¹*, MARIA ABU BAKAR¹, ROSLINA ISMAIL², NUR SHAFIQA SAFEE³, AHMAD GHADAFI ISMAIL¹ & NAJIB SAEDI IBRAHIM⁴

¹Institut Kejuruteraan Mikro & Nano Elektronik (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Division of Fine Arts, Cultural Centre, University of Malaya, 50603, Kuala Lumpur, Wilayah Persekutuan, Malaysia

³Pusat Asasi Pertahanan, Universiti Pertahanan Malaysia, Kem Sungai Besi, 57000 Kuala Lumpur, Wilayah Persekutuan, Malaysia

⁴RedRing Solder (M) Sdn. Bhd., Lot17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia

Received: 2 January 2019/Accepted: 6 March 2019

ABSTRAK

Kesan penuaan terma terhadap sifat kekerasan sambungan pateri Sn-3.0Ag-0.5Cu (SAC305) yang ditambah dengan partikel karbon tiub nano (CNT) telah dikaji. Sifat kekerasan yang menggambarkan kekuatan sambungan pateri ditentukan melalui pendekatan pelekukan nano. Bahan pateri SAC ditambah dengan 0.03% kandungan berat CNT untuk menghasilkan bahan pes pateri SAC-CNT. Pes pateri yang telah dicetak di atas papan litar bercetak (PCB) berkemasan kuprum (Cu) dikenakan pematerian aliran semula pada suhu puncak 260°C untuk menghasilkan sambungan pateri SAC dan SAC-CNT. Sambungan pateri SAC dan SAC-CNT kemudiannya dikenakan penuaan terma melalui ujian penyimpanan suhu tinggi (HTS) selama 200, 400, 600, 800 dan 1000 j pada suhu tetap iaitu 150°C. Sampel sambungan pateri selepas pematerian dan penuaan terma dianalisis melalui kaedah pelekukan nano untuk menentukan sifat kekerasannya. Untuk analisis mikrostruktur, sampel dipunar dan imej dicerap melalui mikroskop optik. Keputusan menunjukkan nilai kekerasan menurun dengan peningkatan masa penuaan bagi kedua-dua sambungan pateri yang dikaji. Walau bagaimanapun, sambungan pateri SAC-CNT mempunyai kekerasan yang lebih tinggi iaitu sebanyak 10-26% berbanding sambungan pateri SAC. Melalui ujian pelekukan nano, sifat mikro kekerasan bagi sambungan pateri akibat tindakan penuaan terma sesuhu yang bersifat setempat dapat ditentukan. Corak nilai mikro kekerasan yang diperoleh adalah selari dengan corak yang diperoleh menggunakan kaedah ujian kekerasan konvensional.

Kata kunci: Karbon nanotiub; kekerasan; pateri Sn-Ag-Cu; pelekukan nano; penuaan terma

ABSTRACT

Effect of thermal aging towards hardness properties of Sn-3.0Ag-0.5Cu (SAC305) solder joint added with carbon nanotube (CNT) particles was investigated. Hardness properties indicate the strength of solder was determined by nanoindentation approach. SAC solder alloy was added with 0.03% weight percent of CNT to form SAC305-CNT solder paste. Printed solder paste on printed circuit board (PCB) with copper (Cu) surface finish underwent reflow soldering at peak temperature 260°C to form SAC305 and SAC305-CNT solder joint. Then, SAC305 and SAC305-CNT were exposed to thermal aging via high temperature storage test (HTS) at constant temperature 150°C for about 200, 400, 600, 800 and 1000 h. Solder joint samples after reflow and thermal aging were analysed using nanoindentation method to determine hardness properties. For microstructure analysis, samples were etched and images were captured via optical microscope. The results showed microhardness values decrease with increasing of aging time for both investigated solder joints. However, hardness values for SAC305-CNT solder joint was higher (~10-26%) compared to SAC305 solder joint without CNT. From nanoindentation test, localized microhardness properties of solder joint under isothermal aging have been attained. Trend of micro hardness values obtained was parallel with the trend gained by using conventional hardness test.

Keywords: Carbon nanotube; hardness; nanoindentation; Sn-Ag-Cu; thermal aging

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*Corresponding author; email: azmn@ukm.my