Sains Malaysiana 48(6)(2019): 1273–1279

http://dx.doi.org/10.17576/jsm-2019-4806-15

Kesan Gelombang Kejutan terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan Pendekatan Pelekukan Nano

(Effect of Shock Wave on Micromechanical Properties of SAC 0307/ENiG Solder Joint using Nanoindentation Approach)

MARIA ABU BAKAR1*, AZMAN JALAR^1,2, WAN YUSMAWATI WAN YUSOFF³, NUR SHAFIQA SAFEE³, ARIFFIN ISMAIL³, NORLIZA ISMAIL¹, EMEE MARINA SALLEH¹ & NAJIB SAEDI IBRAHIM⁴

¹Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Pusat Pengajian Fizik Gunaan, Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

³Pusat Asasi Pertahanan, Universiti Pertahanan Malaysia 3, Kem Sungai Besi, 57000 Kuala Lumpur, Wilayah Persekutuan, Malaysia

⁴Redring Solder (M) Sdn. Bhd., Lot 17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia

Received: 2 January 2019/Accepted: 28 February 2019

ABSTRAK

Kebolehharapan dan kebolehtahanan pempakejan elektronik bagi peralatan elektronik dalam bidang ketenteraan adalah menjangkaui kepenggunaan komersial. Kebolehharapan sambungan pateri merupakan perkara asas bagi penilaian prestasi pempakejan elektronik. Ujian kebolehharapan komersial atau konvensional seperti dalam standard JEDEC (Solid State Technology Association) tidak dapat memenuhi keperluan pempakejan elektronik untuk piawaian ketenteraan. Kajian ini melaporkan gerak balas sambungan logam pateri SAC 0307 pada papan litar bercetak (PCB) dengan kemasan permukaan electroless nickel immersion gold (ENiG) terhadap gelombang kejutan hasil daripada ujian letupan secara terbuka. Perubahan sifat mikromekanik dikaji menggunakan pendekatan pelekukan nano. Gelombang kejutan yang berbeza dikenakan pada sambungan pateri dengan menggunakan bahan Emulex dengan dos sebanyak 700 g dan 1500 g. Kekerasan sambungan pateri telah menyusut sebanyak 29% daripada 141 MPa kepada 100 MPa selepas didedahkan pada gelombang kejutan dengan penggunaan dos Emulex sebanyak 1500 g. Modulus terkurang sambungan pateri juga telah menyusut sebanyak 13% daripada 141 GPa kepada 123 GPa dengan penggunaan dos bahan Emulex sebanyak 1500 g. Ujian gelombang kejutan telah menyebabkan berlakunya perubahan pada sifat mikromekanik sambungan pateri iaitu berlakunya kelakuan perlembutan yang melibatkan penyusutan nilai kekerasan dan modulus terkurang. Tiada retak diperhatikan pada antara sambungan pateri-substrat yang menunjukkan bahawa sambungan pateri adalah tidak gagal dan tetap utuh selepas didedahkan pada gelombang kejutan yang tinggi, walaupun berlaku penyusutan sifat mikromekanik yang ketara.

Kata kunci: Bahan pateri Sn-Ag-Cu; gelombang kejutan; pelekukan nano; sambungan pateri; sifat mikromekanik

ABSTRACT

Reliability and durability of electronic packaging for electronic equipment in military application is beyond commercial applicability. The reliability of a solder joint is a key point in assessing the performance of electronic packaging. Commercial or conventional reliability testing such as JEDEC (Solid State Technology Association) standard is unable to fulfill the electronic packaging requirement for military standards. This study reported the response of SAC 0307 solder joint on printed circuit board (PCB) with ENiG surface finish (electroless nickel immersion gold) towards shock waves resulting from an open-field blast test. Micromechanical properties changes were investigated using nanoindentation approach. The solder joints were exposed to shock wave test using different doses of Emulex, 700 g and 1500 g, respectively. The solder joint's hardness has decreased 29% from 141 MPa to 100 MPa after subjected to shock wave using 1500 g Emulex. The shock wave has led to the changes in micromechanical properties of the solder joints in terms of softening behaviour i.e. the decreasing of hardness and reduced modulus values. However, no cracks were observed between solder-substrate indicate that the solder joint is not fail and remains strong after subjected to high shock wave, despite the significant reduction in micromechanical properties.

Keywords: Micromechanical properties; nanoindentation; shock wave; solder joint; solder materials Sn-Ag-Cu

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*Corresponding author; email: maria@ukm.edu.my