Sains Malaysiana 47(5)(2018): 1005–1010

http://dx.doi.org/10.17576/jsm-2018-4705-16

 

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

(Effect of Coloured Pigment on Intermetallic Compound Growth of Sn-3.0Ag-0.5Cu Solder Joint)

 

AZMAN JALAR^1,2, MARIA ABU BAKAR^1*, ROSLINA ISMAIL¹, NAJIB SAEDI IBRAHIM³ & MOHD ARIFFIN AMBAK³

 

¹Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

²School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

³Redring Solder (M) Sdn. Bhd., Lot 17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia

 

Diserahkan: 21 September 2017/Diterima: 30 Disember 2017

 

 

ABSTRAK

Pewarnaan pes pateri membuka suatu ruang kepada keperluan dalam teknologi untuk proses pengenalpastian, penandaan, piawaian, pengujian dan penilaian terhadap antarasambungan pes pateri. Dua jenis pigmen pewarna iaitu hijau (G) dan bercahaya dalam gelap (GD) digunakan untuk mengkaji kesan pewarnaan sambungan pateri ke atas kestabilan antarasambungan pateri Sn-3.0Ag-0.5Cu (SAC 305). Pes pateri tanpa warna digunakan sebagai sampel kawalan untuk membandingkan keputusan kajian. Uji kaji penuaan sesuhu digunakan untuk melihat perubahan pertumbuhan sebatian antara logam (IMC). Pigmen pewarna GD dengan peratusan sebanyak 5% telah menunjukkan kestabilan pertumbuhan IMC dengan perubahan pertumbuhan yang paling rendah iaitu sebanyak 5.6 μm bagi sambungan pateri yang berwarna berbanding dengan peratusan pigmen pewarna yang lebih tinggi dengan perubahan pertumbuhan IMC sehingga 9 μm selepas didedahkan kepada penuaan sesuhu pada 150°C selama 1000 jam. Walau bagaimanapun, kestabilan pertumbuhan IMC dengan penggunaan pes pateri berwarna adalah lebih rendah berbanding dengan pes pateri tidak berwarna. Maka penambahan pigmen pewarna hendaklah dipertimbangkan dengan mengambil kira kestabilan mikrostruktur dan pertumbuhan lapisan IMC supaya tidak menjejaskan kualiti dan kebolehharapan sesuatu sambungan pateri.

 

Kata kunci: Bahan pateri Sn-Ag-Cu; pateri berwarna; pertumbuhan sebatian antara logam; pigmen pewarna; sambungan pateri

 

ABSTRACT

The colouration of solder paste opens up a space for technology requirements for the identification, marking, standardization, testing and evaluation processes of the solder inconnection. Two types of colour pigments, green (G) and glow in the dark (GD) are used to study the effect of coloured solder on stability of solder joint Sn-3.0Ag-0.5Cu (SAC 305). Colourless solder paste is used as a control sample to compare the results of the study. The isothermal aging test is used to observe the growth of intermetallic compound (IMC). GD colour pigment with a percentage of 5% has shown growth stability with the lowest changes of IMC growth, 5.6 μm for coloured solder joint as compared to other higher colour pigment percentage with higher changes of IMC growth up to 9 μm after subjected to isothermal aging at 150°C for 1000 h. However, IMC growth stability with the use of coloured solder paste is lesser than the colourless solder paste. Therefore, the addition of colour pigments should be considered on the stability of the microstructure and the growth of the IMC layer so that it will not affect the solder joint quality and reliability.

 

Keywords: Colour pigment; coloured solder; intermetallic compound growth; solder joint; solder material Sn-Ag-Cu

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*Pengarang untuk surat-menyurat; email: maria@.ukm.edu.my