Sains Malaysiana 47(7)(2018): 1585–1590

http://dx.doi.org/10.17576/jsm-2018-4707-29

Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma

(Effect of Carbon Nanotube Addition on the Growth of Intermetallic Layer of Sn-Ag-Cu Solder System under Thermal Aging)

NORLIZA ISMAIL¹, AZMAN JALAR¹*, MARIA ABU BAKAR¹ & ROSLINA ISMAIL²

¹Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Division of Fine Arts, Cultural Centre, University of Malaya (UM), 50603 Kuala Lumpur, Wilayah Persekutuan, Malaysia

Received: 15 September 2017/Accepted: 8 March 2018

ABSTRAK

Kesan tiubnano karbon (CNT) terhadap pertumbuhan lapisan sebatian antara logam (IMC) bagi sistem pateri bebas plumbum 96.5Sn-3.0Ag-0.5Cu/substrat Cu telah dikaji. Serbuk aloi Sn-Ag-Cu (SAC305) dicampurkan dengan 0.02 peratus berat CNT untuk menghasilkan pes pateri SAC305-CNT. Kedua-dua pes pateri SAC305 dan SAC305-CNT dicetak secara manual di atas permukaan papan litar bercetak (PCB) dengan kemasan kuprum (Cu) menggunakan kaedah percetakan stensil. Sampel yang telah dicetak dikenakan proses pematerian aliran semula pada suhu 260°C. Sampel yang sudah terpateri dikenakan ujian penuaan terma selama 200, 400, 600, 800 dan 1000 jam menggunakan ketuhar penyimpanan suhu tinggi (HTS) pada suhu malar iaitu 150°C. Ketebalan lapisan sebatian antara logam (IMC) diukur menggunakan alat Pengukuran Fokus Tak Terhingga (IFM®). Keputusan kajian mendapati kadar pertumbuhan lapisan IMC bagi sistem SAC305/Cu-CNT adalah 25% lebih rendah berbanding dengan sistem SAC/Cu. Maka, dicadangkan bahawa penambahan CNT boleh merencatkan pertumbuhan lapisan IMC sebanyak 25% akibat penuaan terma.

Kata kunci: Jerapan tiubnano karbon; pateri Sn-Ag-Cu; pertumbuhan lapisan antara logam; resapan; tiubnano karbon

ABSTRACT

Effect of carbon nanotube (CNT) on the growth of intermetallic compound (IMC) layer of 96.5Sn-3.0Ag-0.5Cu/Cu substrate lead free solder system has been investigated. Sn-Ag-Cu alloy powder (SAC305) was mixed with 0.02 weight percent of CNT to produce SAC-CNT solder paste. Both SAC305 and SAC305-CNT solder paste has been manually printed on the printed circuit board (PCB) with the copper (Cu) surface finish by using stencil printing method. Printed samples were reflowed at temperature 260°C. Soldered samples underwent thermal aging test for the period of 200, 400, 600, 800 and 1000 h using high temperature storage (HTS) oven at a constant temperature 150°C. The thickness of IMC layer was measured by Infinite Focus Measurement (IFM®) equipment. The results found that growth rates of IMC layer for SAC305/Cu-CNT system is 25% lower than SAC/Cu system. Therefore, addition of CNT proposed can retard about 25% of IMC layer growth under thermal aging.

Keywords: Carbon nanotube; carbon nanotube adsorption; diffusion; intermetallic layer growth; Sn-Ag-Cu solder

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*Corresponding author; email: azmn@ukm.my