Sains Malaysiana 47(9)(2018): 2157–2162

http://dx.doi.org/10.17576/jsm-2018-4709-25

 

Pengawalan Pertumbuhan Sebatian antara Logam Sambungan Pateri-Papan Litar Bercetak Menggunakan Salutan Nikel

(Controlling of Intermetallic Compound Solder Interconnection-Printed Circuit Board using Nickel Coating)

 

MARIA ABU BAKAR¹, AZMAN JALAR^1,2*, MOHD ZULKIFLY ABDULLAH³, NAJIB SAEDI IBRAHIM⁴ & MOHD ARIFFIN AMBAK⁴

 

¹Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

²School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

³School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 314300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia

 

⁴Redring Solder (M) Sdn. Bhd., Lot 17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia

 

Received: 31 March 2018/Accepted: 15 May 2018

 

ABSTRAK

Bahan aloi pateri dalam kumpulan Sn-Ag-Cu (SAC) merupakan bahan pematerian yang bebas plumbum digunakan secara meluas dalam industri elektronik. Antarasambungan pateri bertindak untuk menghubungkan komponen elektronik pada papan litar bercetak (PCB). PCB memainkan peranan yang penting dalam tindak balas pematerian dan mikrostruktur antarasambungan pateri-substrat seterusnya mempengaruhi kebolehharapan suatu sambungan pateri. Pes pateri Sn0.3Ag0.7Cu (SAC0307) dipaterikan pada tiga jenis PCB iaitu PCB tanpa salutan (PCB/Cu) sebagai sampel kawalan, PCB dengan salutan timah (PCB/Sn) dan PCB dengan salutan nikel (PCB/Ni). Kajian ini bertujuan untuk mengkaji kesan salutan permukaan PCB ke atas pertumbuhan sebatian antara logam (IMC) selepas uji kaji penuaan sesuhu yang berbeza selama 1000 jam. Keputusan menunjukkan purata ketebalan lapisan IMC ~ 5.7 μm serta kadar pertumbuhan lapisan IMC yang paling rendah adalah selari dengan tenaga pengaktifan tertinggi dengan salutan Ni iaitu 41 kJ/mol berbanding PCB/Cu dan PCB/Sn. Ini bermakna salutan Ni pada PCB mampu mengawal pertumbuhan IMC sehingga lebih kurang 40% berbanding salutan Sn dan tanpa salutan.

 

Kata kunci: Antarasambungan pateri; salutan Ni; sebatian antara logam; Sn-Ag-Cu; tenaga pengaktifan

 

ABSTRACT

Solder alloy materials in Sn-Ag-Cu (SAC) group is a lead free soldering materials which widely used in the electronics industry. Solder interconnection act to attach electronic components to printed circuit boards (PCBs). PCB plays an important role in soldering reactions and microstructure solder interconnection-substrate which further affects the reliability of a solder joint. Solder paste of Sn0.3Ag0.7Cu (SAC0307) is soldered on three types of PCB ie PCB without coating (PCB/Cu) as controlled sample, PCB with tin coating (PCB/Sn) and PCB with nickel coating (PCB/Ni). The purpose of this study was to investigate the effect of PCB surface coating on the growth of intermetallic compound (IMC) after different aging tests for 1000 h. The results showed that the average IMC layer thickness ~ 5.7 μm together with lowest IMC layer growth rate is in line with highest activation energy, 41 kJ/mol with the usage of Ni coating as compared to PCB/Cu and PCB/Sn. This means that the Ni coating on PCB is able to control IMC growth up to 40% compared to Sn coating and non-coating.

 

Keywords: Activation energy; intermetallic compound; Ni coating; Sn-Ag-Cu; solder interconnection

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*Corresponding author; email: azmn@ukm.edu.my