Sains Malaysiana 49(12)(2020): 3029-3036

http://dx.doi.org/10.17576/jsm-2020-4912-14

Effect of Coating Element on Joining Stability of Sn-0.3Ag-0.7Cu Solder Joint due to Aging Test

(Kesan Unsur Salutan terhadap Kestabilan Sambungan PateriSn-0.3Ag-0.7Cu Akibat Ujian Penuaan Sesuhu)

ATIQAH MOHD AFDZALUDDIN & MARIA ABU BAKAR*

Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

Received: 12 August 2020/Accepted: 18 August 2020

ABSTRACT

Solder joint is important for providing mechanical support and functionality of electronic packaging. Established solder joint should be able to withstand in device service operation and the environment without significant changes in terms of their microstructural evolution and mechanical properties. This study investigates the effect of the coating element (Sn and Ni) on the joining stability of Sn-0.3Ag-0.7Cu solder joint. The solder joints were exposed to different aging test for 1000 h to observed microstructure and micromechanical properties changes. Microstructural observation by means of intermetallic compound layer thickness due to the aging temperature effect. Joining stability by means of micromechanical changes were studied using nanoindentation approach. It was found that the elastic behavior, reduced modulus, and hardness of Sn-0.3Ag-0.7Cu solder joint has reduced due to aging test. However, the plastic behavior of Sn-0.3Ag-0.7Cu solder joint has increased with the increase of the aging temperature. It is observed that the Ni coating has a significant effect and a more stable solder joint achieved. This can be evidenced from small changes in intermetallic compound layer thickness and micromechanical properties were achieved using Ni coating as compared to Sn coating after subjected to the aging test for 1000 h.

Keywords: Aging; coating element; micromechanical properties; nanoindentation approach; solder joint stability

ABSTRAK

Sambungan pateri adalah penting untuk memberi sokongan mekanik dan kefungsian kepada pempakejan elektronik. Sambungan pateri yang baik seharusnya boleh bertahan ketika operasi penggunaan peranti dan persekitaran tanpa perubahan yang ketara dari segi perubahan mikrostruktur dan sifat mekanik. Kajian ini mengkaji kesan salutan dengan unsur (Sn dan Ni) terhadap kestabilan sambungan pateri Sn-0.3Ag-0.7Cu. Sambungan pateri tersebut telah didedahkan pada beberapa uji kaji penuaan yang berbeza selama 1000 jam dan perubahan mikrostuktur dan sifat mikromekanik diperhatikan. Pemerhatian mikrostruktur adalah dari segi perubahan ketebalan lapisan sebatian antara logam akibat uji kaji penuaan sesuhu. Kestabilan penyambungan dari segi perubahan mikromekanik telah dikaji dengan menggunakan pendekatan pelekukan nano. Kajian telah mendapati bahawa sifat elastik, penurunan modulus dan kekerasan sambungan pateri Sn-0.3Ag-0.7Cu berkurangan akibat daripada ujian penuaan. Walau bagaimanapun, sifat plastik bagi sambungan pateri Sn-0.3Ag-0.7Cu telah meningkat seiring dengan peningkatan suhu uji kaji penuaan sesuhu. Didapati bahawa salutan Ni menunjukkan kesan ketara yang mana sambungan pateri yang lebih stabil diperoleh. Kenyataan tersebut dapat dibuktikan dengan perubahan kecil ketebalan lapisan sebatian antara logam dan sifat mikromekanik dengan penggunaan salutan Ni berbanding dengan salutan Sn selepas didedahkan pada uji kaji penuaan selama 1000 jam.

Kata kunci: Kestabilan sambungan pateri; pendekatan pelekukan nano; penuaan sesuhu; sifat mikromekanik; unsur salutan

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*Corresponding author; email: maria@ukm.edu.my