Sains Malaysiana 46(7)(2017): 1075–1082

http://dx.doi.org/10.17576/jsm-2017-4607-09

 

Electrophoretic Deposition of Carbon Nanotubes on Heat Spreader for Fabrication of Thermal Interface Materials (TIM)

(Pengendapan Elektroforesis Karbon Tiub Nano ke atas Penyebar Hab untuk Fabrikasi Bahan Antara Dua Muka Haba (TIM))

 

RAIHANA BAHRU¹, ABDUL RAHMAN MOHAMED¹*, WEI-MING YEOH² & KHATIJAH AISHA YAACOB³

 

¹School of Chemical Engineering, Universiti Sains Malaysia, 11800 USM Nibong Tebal,

Pulau Pinang, Malaysia

 

²Department of Petrochemical Engineering, Faculty of Engineering and Green Technology, Universiti Tunku Abdul Rahman, Jalan Universiti, Bandar Barat, 31900 Kampar, Perak Darul Ridzuan, Malaysia

 

³School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 11800 USM Nibong Tebal, Pulau Pinang, Malaysia

 

Received: 23 December 2016/Accepted: 27 February 2017

 

ABSTRACT

Thermal interface materials (TIMs) are applied in packaging of electronic devices for heat dissipation purposes. Carbon nanotubes (CNTs) are promising material due to their high thermal conductivity properties which will give optimum performance as TIMs. In this research study, electrophoretic deposition (EPD) is used which enables the deposition process conduct at room temperature with simple equipment setup which beneficial for CNTs deposition. As-produced CNTs was purified and directly deposited on heat spreader using direct current (DC) electricity. Dimethylformamide (DMF) was used as suspension medium for CNTs and the effect of suspension concentration was studied. From the screening of suspension concentration, 0.50 mg/mL yielded good deposition with thickness of 4.78 μm of CNTs deposited on heat spreader at applied voltage of 150V and 10 min deposition time. Further studied in different applied voltage and voltage of 250 V shows the maximum thickness of 15.01 μm with 2.0 mg weight of deposited CNTs which is suitable for fabrication of TIM.

 

Keywords: Carbon nanotubes; electrophoretic deposition; thermal interface materials

 

ABSTRAK

Bahan antara dua muka haba diaplikasikan dalam pakej alatan elektronik untuk tujuan pelesapan haba. Karbon tiub nano (CNT) dipilih kerana ia mempunyai konduktiviti haba baik yang dapat memberi prestasi optimum sebagai bahan antara dua muka haba. Di dalam kajian ini, pengendapan elektroforesis (PE) adalah digunakan bagi membolehkan proses pengendapan dilakukan pada suhu bilik berserta pemasangan alatan yang ringkas iaitu bermanfaat dalam pengendapan NK. NK yang telah dihasilkan kemudiannya ditulenkan dan diendapkan terus di atas penyebar haba menggunakan elektrik arus terus (AT). Dimetilformamida (DMF) digunakan sebagai medium ampaian untuk NK dan kesan kepekatan ampaian telah dikaji. Kepekatan ampaian, 0.50 mg/mL menghasilkan endapan NK yang baik dengan ketebalan 4.78 μm di atas penyebar haba pada voltan gunaan 150V dan 10 min masa endapan. Kajian diteruskan bagi voltan gunaan yang berbeza dan menunjukkan voltan gunaan 250V menghasilkan tebal maksimum 15.01 μm dengan 2.0 mg berat endapan NK yang sesuai untuk fabrikasi bahan antara dua muka haba.

 

Kata kunci: Bahan antara dua muka haba; nanotiub karbon; pengendapan elektroforesis

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*Corresponding author; email: chrahman@usm.my